Positive photoresists have a chemical structure that allows the areas exposed to light to develop at a faster rate than those areas not exposed to light. Example: Positive photoresists remain the most common type of resist used in the semiconductor industry. Positive resists increase in solubility upon UV exposure enabling the exposed regions to be removed in the solvent developer leaving the underlying material. The areas of the photoresist that aren’t exposed to the UV light are left insoluble to the photoresist developer. When working with positive photoresists in the semiconductor manufacturing industry, you receive an identical copy of the pattern, which is exposed as a mask on the wafer (or other substrate).
KL 5302 Hi-Res Positive Thin
Film Thickness: 0.2 microns
Applications: Diffraction Grating, Interference Lithography
Designed for film thickness of ~200 nm. It is applied in interference or holographic lithography. Also, applied in broadband exposure tools or steppers
KL 5300 Series General Purpose Positive Thin
Film Thickness: 0.5 - 2.0 microns
Applications: IC fabrication
KL5300 series are positive photoresists for use in i-Line, g-Line and broadband applications. They offer high sensitivity, high resolution and excellent process latitude. They are designed for use with industry standard 0.26 N TMAH developers. Resolution of 0.55 µm can be achieved. Custom formulations are available.
KL 6000 Series General Purpose Positive Thick
Film Thickness: 2.5 – 12 microns
Applications: advanced packaging, TSV, bumping, electroplating
KL6000 series are positive photoresists for use in i-Line, g-Line and broadband applications. KL6000 offers high sensitivity, high throughput, and excellent process latitude. It is designed for use with industry standard 0.26 N TMAH developers. There is no PEB necessary. Custom formulations are available.
K-PRO™ Advanced Packaging Thick
Film Thickness: 5 – 25+ microns
Applications: Advanced Packaging, Plating, TSV, Bumping
K-PRO™ photoresists are advanced packaging positive resists for use in i-line, g-line and broadband packaging applications. They are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.