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Woburn, Massachusetts USA

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Positive Photoresists

Positive photoresists have a chemical structure that allows the areas exposed to light to develop at a faster rate than those areas not exposed to light. Example: Positive photoresists remain the most common type of resist used in the semiconductor industry. Positive resists increase in solubility upon UV exposure enabling the exposed regions to be removed in the solvent developer leaving the underlying material. The areas of the photoresist that aren’t exposed to the UV light are left insoluble to the photoresist developer. When working with positive photoresists in the semiconductor manufacturing industry, you receive an identical copy of the pattern, which is exposed as a mask on the wafer (or other substrate).

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Tone: Positive

Film Thickness: 0.2 microns

Applications: Diffraction Grating, Interference Lithography

Designed for film thickness of ~200 nm. It is applied in interference or holographic lithography. Also, applied in broadband exposure tools or steppers

KL 5302 Hi-Res Positive Thin

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Tone: Positive

Film Thickness: 0.5 - 2.0 microns

Applications: IC fabrication

KL5300 series are positive photoresists for use in i-Line, g-Line and broadband applications. They offer high sensitivity, high resolution and excellent process latitude. They are designed for use with industry standard 0.26 N TMAH developers. Resolution of 0.55 µm can be achieved. Custom formulations are available.

KL 5300 Series General Purpose Positive Thin

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Tone: Positive

Film Thickness: 2.5 – 12 microns

Applications: advanced packaging, TSV, bumping, electroplating

KL6000 series are positive photoresists for use in i-Line, g-Line and broadband applications. KL6000 offers high sensitivity, high throughput, and excellent process latitude. It is designed for use with industry standard 0.26 N TMAH developers. There is no PEB necessary. Custom formulations are available.

KL 6000 Series General Purpose Positive Thick

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Tone: Positive

Film Thickness: 5 – 25+ microns

Applications: Advanced Packaging, Plating, TSV, Bumping

K-PRO is an advanced packaging positive photoresist for use in i-line, g-line and broadband packaging applications. It offers high sensitivity, high throughput, and excellent process latitude. It is designed for use with metal-ion or metal-ion free developers. There is no PEB required. Custom formulations are available.

K-PRO Advanced Packaging Thick