K-PRO

Advanced Packaging Thick Positive Photoresist

Description

K-PRO photoresists are advanced packaging positive resists for use in i-line, g-line and broadband packaging applications. They are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications. 

  • Cover 5 – 25 µm in a single coat

  • Double-coat process available for up to 50 microns

  • Designed for use with metal-ion or metal-ion free developers

  • No PEB required

Volumes & Customization

Sizes available: 100ml sample, 500ml, 1L, 4L

Production volumes available

Custom thicknesses and formulations are available by request

k-pro data sheet
advanced_packaging_thick_resist_kemab
spincurve_thin_kpro.jpg
spincurve_thick_kpro.jpg
advanced_packaging_SEM
5um posts, Cu, 70d, 1KX_copper_posts