Copyright © KemLab™ Inc. 2012-2020. All Rights Reserved.

Woburn, Massachusetts USA

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Advanced Packaging Resist

10um posts, Cu, 70d, 1KX, 2.jpg

Tone: Positive

Film Thickness: 5 – 25+ microns

Applications: Advanced Packaging, Plating, TSV, Bumping

K-PRO™ photoresists are advanced packaging positive resists for use in i-line, g-line and broadband packaging applications. They are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications. 

K-PRO™ Advanced Packaging Thick