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Woburn, Massachusetts USA

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Advanced Packaging Resist

10um posts, Cu, 70d, 1KX, 2.jpg

Tone: Positive

Film Thickness: 5 – 25+ microns

Applications: Advanced Packaging, Plating, TSV, Bumping

K-PRO is an advanced packaging positive photoresist for use in i-line, g-line and broadband packaging applications. It offers high sensitivity, high throughput, and excellent process latitude. It is designed for use with metal-ion or metal-ion free developers. There is no PEB required. Custom formulations are available.

K-PRO Advanced Packaging Thick