Advanced Packaging Resist
K-PRO™ Advanced Packaging Thick
Film Thickness: 5 – 25+ microns
Applications: Advanced Packaging, Plating, TSV, Bumping
K-PRO™ photoresists are advanced packaging positive resists for use in i-line, g-line and broadband packaging applications. They are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications.