Film Thickness: 2.5 – 12 microns
Applications: advanced packaging, TSV, bumping, electroplating
KL6000 series are positive photoresists for use in i-Line, g-Line and broadband applications. KL6000 offers high sensitivity, high throughput, and excellent process latitude. It is designed for use with industry standard 0.26 N TMAH developers. There is no PEB necessary.
Cover 2.5 – 12 µm in a single coat
Designed for use with industry standard TMAH 0.26N developers
No PEB necessary
Competes with SPR™ 220-3.0/S1827™, SPR™ 220-4.5, SPR™ 220-7.0, and S1827™