Film Thickness: 0.5 - 2.0 microns
Applications: IC fabrication
KL5300 series are positive photoresists for use in i-Line, g-Line and broadband applications. They offer high sensitivity, high resolution and excellent process latitude. They are designed for use with industry standard 0.26 N TMAH developers. Resolution of 0.55 µm can be achieved.
Cover 0 – 2.5 µm in a single coat
Designed for use with industry standard TMAH 0.26N developers
Achieve resolution 0.55 µm
Competes with S1805™, S1808™, S1811™, S1813™, S1818™