KemLab K-PRO Packaging Thick Positive Photoresist

Tone: Positive

Film Thickness: 5 – 25+ microns

Applications: Advanced Packaging, Plating, TSV, Bumping

 

K-PRO™ photoresists are advanced packaging positive resists for use in i-line, g-line and broadband packaging applications. They are compatible with plating metals including copper, pure tin, and nickel and offer high sensitivity, high throughput, and excellent process latitude. K-PRO™ positive-tone photoresists are designed to cover varied terrain for advanced wafer level packaging, MEMS, and 3D photolithography applications. 

 

  • Cover 5 – 25 µm in a single coat

  • Double-coat process available for up to 50 microns

  • Designed for use with metal-ion or metal-ion free developers

  • No PEB required

 

LINK TO PRODUCT PAGE

KemLab K-PRO Packaging Thick Positive Photoresist

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Woburn, Massachusetts USA

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