SQ Nova 3K is a high-performance, epoxy-based negative photoresist designed for high-precision applications such as micromachining, microfluidics, and MEMS. Advancing earlier SQ SU-8 technologies, it delivers improved adhesion, lower intrinsic film stress, faster processing, and sharply defined vertical sidewalls. The material supports crosslinked film thicknesses from 2 to 120 μm in a single spin coat and enables high-aspect-ratio structures of up to 10:1. It also provides excellent optical clarity, with strong transmission above 400 nm.
SQ Nova 3K is an advanced evolution of SQ SU-8 photoresist, engineered with upgraded materials to deliver superior performance. Its formulation uses MMP solvent, a non-PFAS surfactant, and electronic-grade epoxies to improve reliability and consistency. MMP is less toxic and less polar, enabling faster drying, uniform coatings, and shorter development times.
ADVANTAGES
Superb adhesion and reduced film stress
High‑contrast, high aspect ratio patterning
Vertical sidewall profiles suitable for MEMS and microfluidic devices
Less toxic, less polar, fast-drying solvent
Clean, efficient development with reduced develop times
Microelectronics‑grade epoxy resin for superior cleanliness and excellent lot‑to‑lot lithographic reproducibility
Enhanced alternative to SU-8 3000
FEATURES
Chemistry: SU-8 polymer epoxy
Solvent: MMP (methyl 3‑methoxypropionate, CAS 3852‑09‑3)
Tone: Negative
Film Thickness: Up to 120 µm single coat
Sensitivity: NUV, Broadband, i-line
Developer: SQ SU-8, SU-8
Products: SQ Nova 3K 2, 5, 10, 25, 50