SQ Nova 3K is a high-performance, epoxy-based negative photoresist designed for high-precision applications such as micromachining, microfluidics, and MEMS. Advancing earlier SQ SU-8 technologies, it delivers improved adhesion, lower intrinsic film stress, faster processing, and sharply defined vertical sidewalls. The material supports crosslinked film thicknesses from 2 to 120 μm in a single spin coat and enables high-aspect-ratio structures of up to 10:1. It also provides excellent optical clarity, with strong transmission above 400 nm.
SQ Nova 3K is an advanced evolution of SQ SU-8 photoresist, engineered with upgraded materials to deliver superior performance. Its formulation uses MMP solvent, a non-PFAS surfactant, and electronic-grade epoxies to improve reliability and consistency. MMP is less toxic and less polar, enabling faster drying, uniform coatings, and shorter development times.
ADVANTAGES
- Superb adhesion and reduced film stress
- High‑contrast, high aspect ratio patterning
- Vertical sidewall profiles suitable for MEMS and microfluidic devices
- Less toxic, less polar, fast-drying solvent
- Clean, efficient development with reduced develop times
- Microelectronics‑grade epoxy resin for superior cleanliness and excellent lot‑to‑lot lithographic reproducibility
- Enhanced alternative to SU-8 3000
FEATURES
Chemistry: SU-8 polymer epoxy
Solvent: MMP (methyl 3‑methoxypropionate, CAS 3852‑09‑3)
Tone: Negative
Film Thickness: Up to 120 µm single coat
Sensitivity: NUV, Broadband, i-line
Developer: SQ SU-8, SU-8
Products: SQ Nova 3K 2, 5, 10, 25, 50