Negative Type Macro Photoresist
Polyisoprene-based resist for broad range projection, proximity and contact imaging and wet etch needs on various substrates. Ability to withstand a variety of acid and alkaline etch baths for extended periods of time.
Chemically milled metal parts
Viscosity: 470-530 mPas @ 25ºC
Color: Clear, Yellow
Sensitivity: 200-400 nm
Typical light sources: Carbon-arc, mercury-vapor, metal halide diazo, mercury-arc
Coating methods: Roller coating, spray, dip, spin, slot-die, screen-print
Substrates: Metal, glass, silicon, polyester and nylon fabrics, copper, stainless steel, ceramic
Developer: 50/50 Heptane/Hexane or industry standard developers (KPR, KTFR, KPR3, KPR4, etc.)
Shelf-Life: 12 months (Avoid light, store at 10-25ºC)
Equipment clean-up: 50/50 Heptane/Hexane, 100% Hexane or butyl acetate
Processing steps: Varies by industry. See processing example below for copper surface substrate.
Container Sizes: 1 Qt., 1 Gal.
EXAMPLE OF PROCESSING GUIDELINES FOR COPPER SURFACE SUBSTRATE
Clean surface: Clean the surface with Isopropyl alcohol (IPA) followed by hotplate proximity bake
at 110ºC for 2 minutes
Coat resist: Spin coater setting at 750 RPM with an acceleration of 750 RPM for 30 seconds
Soft bake: Hotplate proximity bake at 110ºC for 5 minutes
Exposure: Broadband (mercury-arc lamp) at approximately 250 mj depending on film thickness
Development: 50/50 Heptane/Hexane or 100% Heptane for approximately 4 minutes depending
on film thickness
Post-exposure bake: PEB not necessary