BN308-450

Negative Type Macro Photoresist

 

DESCRIPTION

Polyisoprene-based resist for broad range projection, proximity and contact imaging and wet etch needs on various substrates. Ability to withstand a variety of acid and alkaline etch baths for extended periods of time.

 

APPLICATIONS

Stencils

Integrated circuits

Chemically milled metal parts

Screen-printing

Photo gravure

Photo engraving

 

SPECIFICATIONS

Viscosity:                               470-530 mPas @ 25ºC

Color:                                     Clear, Yellow

Sensitivity:                             200-400 nm

Typical light sources:           Carbon-arc, mercury-vapor, metal halide diazo, mercury-arc

Coating methods:                Roller coating, spray, dip, spin, slot-die, screen-print

Substrates:                           Metal, glass, silicon, polyester and nylon fabrics, copper, stainless steel, ceramic

Thinner:                                 Xylenes

Developer:                            50/50 Heptane/Hexane or industry standard developers (KPR, KTFR, KPR3, KPR4, etc.)

Shelf-Life:                              12 months (Avoid light, store at 10-25ºC)

Equipment clean-up:          50/50 Heptane/Hexane, 100% Hexane or butyl acetate

Processing steps:                Varies by industry. See processing example below for copper surface substrate.

Container Sizes:                  1 Qt., 1 Gal.

 

EXAMPLE OF PROCESSING GUIDELINES FOR COPPER SURFACE SUBSTRATE

  1. Clean surface:              Clean the surface with Isopropyl alcohol (IPA) followed by hotplate proximity bake

  2. at 110ºC for 2 minutes

  3. Coat resist:                   Spin coater setting at 750 RPM with an acceleration of 750 RPM for 30 seconds

  4. Soft bake:                      Hotplate proximity bake at 110ºC for 5 minutes

  5. Exposure:                      Broadband (mercury-arc lamp) at approximately 250 mj depending on film thickness    

  6. Development:              50/50 Heptane/Hexane or 100% Heptane for approximately 4 minutes depending

  7. on film thickness

  8. Post-exposure bake:   PEB not necessary

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Woburn, Massachusetts USA

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